JPH02104643U - - Google Patents
Info
- Publication number
- JPH02104643U JPH02104643U JP1399589U JP1399589U JPH02104643U JP H02104643 U JPH02104643 U JP H02104643U JP 1399589 U JP1399589 U JP 1399589U JP 1399589 U JP1399589 U JP 1399589U JP H02104643 U JPH02104643 U JP H02104643U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- center
- semiconductor device
- external terminals
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1399589U JPH02104643U (en]) | 1989-02-08 | 1989-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1399589U JPH02104643U (en]) | 1989-02-08 | 1989-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104643U true JPH02104643U (en]) | 1990-08-20 |
Family
ID=31224794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1399589U Pending JPH02104643U (en]) | 1989-02-08 | 1989-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104643U (en]) |
-
1989
- 1989-02-08 JP JP1399589U patent/JPH02104643U/ja active Pending